Our Services
Innovative Solutions, Tailored for Every Industry
Explore our diverse range of advanced technological services designed to address the unique needs of industries worldwide. From precision laser technology to semiconductor innovations, GIT empowers businesses with cutting-edge solutions that drive efficiency, sustainability, and growth.
Micro Cutting
Semiconductor Industry
Laser micro-cutting solutions for intricate designs and high precision.
Jobshop Services
Custom Solutions
Flexible job-shop services tailored to meet unique project requirements.
Wafer Downsizing
Semiconductor Industry
Precision downsizing and edge grinding for silicon carbide wafers with unmatched accuracy.
SiC Technology
Advanced Materials
Silicon carbide wafer advancements for high-performance electronics and power systems.
LASER Micro-LED Lift off process
Glass Processing
Innovative laser technology for efficient thin-film material separation.
Glass Welding
Renewable Energy
Advanced laser-based welding solutions for ultra-thin and high-strength glass.
AR VR Cutting
Technology Applications
Precision cutting for augmented and virtual reality glass, enhancing optical performance.
Ultra-Thin Cutting
Advanced Materials
High-precision laser cutting for ultra-thin glass applications.
Through Via Glass
Semiconductor & Electronics
Enabling advanced semiconductor designs with high-precision through-glass vias for enhanced electrical performance.
Micro Drilling
Micro Drilling
Advanced laser micro-drilling for high-precision applications.
Edge Polishing
Glass Processing
High-quality laser polishing for smooth and durable glass edges.
Diamond Technology
Advanced Materials
Cutting-edge diamond wafer technology for next-gen semiconductor applications.